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Advances and Challenges in Thermal Processing with Flexible Packages

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Advances in Food Process Engineering Research and Applications

Part of the book series: Food Engineering Series ((FSES))

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Abstract

This chapter describes current work under way to address some of the engineering challenges facing the thermal processing of products in new flexible packaging systems, with particular focus on head space pressure. Methodologies are described for experimental determination of optimum overriding retort pressure profiles involving the use of commercially available deflection detectors and custom-designed rigid airtight containers with wireless pressure sensors. The development of a mathematical model for predicting head space pressure is also described and tested by comparing the model predicted with experimentally measured head space pressure profiles. Results showed that the error between measured and predicted pressures ranged from 2 % to 4 % for pure water and green beans in water and 7 % to 13 % for a sucrose solution and sweet peas in water.

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Acknowledgments

The authors are grateful to:

• Ellab, Centennial, CO, USA, for loan of the wireless data logger system throughout the duration of the project;

• Chilean Foundation for Development (FONDECYT Project 1090689) for its support of collaboration; and

• Florida Agricultural Experiment Station at the University of Florida’s Institute of Food and Agricultural Sciences, Gainesville, FL, USA.

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Correspondence to Arthur Teixeira .

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Teixeira, A., Ghai, G., Almonacid, S. (2013). Advances and Challenges in Thermal Processing with Flexible Packages. In: Yanniotis, S., Taoukis, P., Stoforos, N., Karathanos, V. (eds) Advances in Food Process Engineering Research and Applications. Food Engineering Series. Springer, Boston, MA. https://doi.org/10.1007/978-1-4614-7906-2_11

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