Abstract
Thermal management has become a critical issue for high performance technology in defense electronic systems designs [1]. Defense electronic devices, such as the High Energy Laser (HEL) and the Active radar system, have increased in power consumption and reduced in physical size. This increased power density has led to an increasing intensity in heat generation. Thermal management is a series of systematic steps to remove this excessive generated heat during normal operation. Heat dissipation from defense applications is at heat fluxes of the order of 1,000 W/cm2 [2, 3]. This high heat dissipation rate is primarily due to the greater functionalities and higher packaging densities. To ensure safe and reliable operations of electronic devices, there is a need for high capacity thermal management techniques. It therefore seems likely that new techniques will be needed in the near future.
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Alam, T., Lee, P.S., Jin, LW. (2014). Introduction. In: Flow Boiling in Microgap Channels. SpringerBriefs in Applied Sciences and Technology(). Springer, New York, NY. https://doi.org/10.1007/978-1-4614-7190-5_1
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DOI: https://doi.org/10.1007/978-1-4614-7190-5_1
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