Humidity and Electromigration Tests

  • Preeti S. Chauhan
  • Anupam Choubey
  • ZhaoWei Zhong
  • Michael G. Pecht


This chapter discusses the effects of high humidity and high temperature, as well as high current densities, on the reliability of Cu wire bonds. Reliability data are provided from humidity reliability tests, pressure cooker tests, and highly accelerated stress tests on Cu wire-bonded parts. Comparisons are made between the humidity-related reliability of Cu and PdCu wire bonds. Electromigration tests to evaluate the reliability of wire bonds under high electrical current are also presented.


Wire Bond Ball Bond Electromigration Test Autoclave Test Pressure Cooker Test 
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Copyright information

© Springer Science+Business Media New York 2014

Authors and Affiliations

  • Preeti S. Chauhan
    • 1
  • Anupam Choubey
    • 2
  • ZhaoWei Zhong
    • 3
  • Michael G. Pecht
    • 1
  1. 1.Center for Advanced Life Cycle Engineering (CALCE)University of MarylandCollege ParkUSA
  2. 2.Industry ConsultantMarlboroughUSA
  3. 3.School of Mechanical & Aerospace EngineeringNanyang Technological UniversitySingaporeSingapore

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