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Bonding Metallurgies

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Book cover Copper Wire Bonding

Abstract

This chapter explains the wire bonding metallurgies for Cu and PdCu wires. The most common variations are bare Cu wires, PdCu wires with Al bond pads, and Ni/Au bond pads. The interfacial metallurgies of bare Cu wire on Al-, Ni-, and Cu-based bond pads are examined. Comparisons are made between the interfacial intermetallics, Au–Al, Cu–Al, and Cu–Au, at the bond–pad interface. The growth rates and electrical, mechanical, and thermal properties of the intermetallics are presented. The bond–pad interfaces for Ni-based finishes, such as Au–AuNi, Au–AuPdNi, Cu–AuNi, and Cu–AlPdNi, are also assessed.

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Authors and Affiliations

  1. Center for Advanced Life Cycle Engineering (CALCE), University of Maryland, College Park, MD, USA

    Preeti S. Chauhan & Michael G. Pecht

  2. Industry Consultant, Marlborough, MA, USA

    Anupam Choubey

  3. School of Mechanical & Aerospace Engineering, Nanyang Technological University, Singapore, Singapore

    ZhaoWei Zhong

Authors
  1. Preeti S. Chauhan
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  2. Anupam Choubey
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  3. ZhaoWei Zhong
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  4. Michael G. Pecht
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Chauhan, P.S., Choubey, A., Zhong, Z., Pecht, M.G. (2014). Bonding Metallurgies. In: Copper Wire Bonding. Springer, New York, NY. https://doi.org/10.1007/978-1-4614-5761-9_3

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  • DOI: https://doi.org/10.1007/978-1-4614-5761-9_3

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