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Bonding Process

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Copper Wire Bonding

Abstract

This chapter presents the wire bonding process, including the influence of process parameters on the wire bonds and bond process optimization. Bonding parameters such as ultrasonic power, ultrasonic generator current, electric flame-off current, firing time, bonding force, and temperature are discussed. The potential defects and failures that could arise during the bonding process and the bonding damage induced by tools are explained.

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Notes

  1. 1.

    The material purity in % or Nines scale is denoted in terms of purity in parts-per-million (ppm). For example, 1 N  = 90 %, 2 N = 99 %, 3 N = 99.9 % and so on.

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Authors and Affiliations

  1. Center for Advanced Life Cycle Engineering (CALCE), University of Maryland, College Park, MD, USA

    Preeti S. Chauhan & Michael G. Pecht

  2. Industry Consultant, Marlborough, MA, USA

    Anupam Choubey

  3. School of Mechanical & Aerospace Engineering, Nanyang Technological University, Singapore, Singapore

    ZhaoWei Zhong

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  1. Preeti S. Chauhan
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  2. Anupam Choubey
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  3. ZhaoWei Zhong
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  4. Michael G. Pecht
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Chauhan, P.S., Choubey, A., Zhong, Z., Pecht, M.G. (2014). Bonding Process. In: Copper Wire Bonding. Springer, New York, NY. https://doi.org/10.1007/978-1-4614-5761-9_2

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