Skip to main content

Air Cooling for LED Lighting

  • Chapter
  • First Online:
Thermal Management for LED Applications

Part of the book series: Solid State Lighting Technology and Application Series ((SSLTA,volume 2))

Abstract

A Light Emitting Diode (LED) is a semiconductor that converts electrical energy into light and heat. Typically, energy conversion efficiencies, i.e., the percentage of input energy converted to light, are in the 20–40 % range, resulting in a significant amount of heat being generated in the pn junction of the LED. In most applications, this heat has to be conducted away from the junction and then convected and/or radiated to the ambient air. The convective part of the heat transfer usually requires extended surfaces or heat sinks and in many cases, a method of creating airflow over the heat sink to transport the heat away into the ambient, and is generally referred to as air-side heat transfer. This chapter will discuss the various methods that can be employed for air-side heat transfer. The chapter is divided into five major sections. Section 2 deals with the system-level thermal management of LEDs and discusses the importance of cooling LEDs as well as the various thermal paths and resistances involved in a typical LED system. Section 3 describes the fundamentals of both natural and forced convection heat transfer, including some basic relations and equations used in convective heat transfer. Section 4 describes the different technologies that exist today for air-side heat transfer. Section 5 compares the different technologies with respect to the system-level metrics such as acoustics, power consumption, reliability, etc., required for designing a cooling solution. Finally, Sect. 6 summarizes the chapter.

This is a preview of subscription content, log in via an institution to check access.

Access this chapter

Chapter
USD 29.95
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
eBook
USD 129.00
Price excludes VAT (USA)
  • Available as EPUB and PDF
  • Read on any device
  • Instant download
  • Own it forever
Softcover Book
USD 169.99
Price excludes VAT (USA)
  • Compact, lightweight edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info
Hardcover Book
USD 169.99
Price excludes VAT (USA)
  • Durable hardcover edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info

Tax calculation will be finalised at checkout

Purchases are for personal use only

Institutional subscriptions

Similar content being viewed by others

Notes

  1. 1.

    The huge thermal capacitance, however, plays an important role in dynamic mode, e.g., when an LED is AC-driven or when it is PWM dimmed—resulting in reduced absolute value of the AC thermal impedance at higher operating frequencies or reduced pulsed thermal resistance values when the frequency of the PWM dimming is higher. See details on this in Chap. 3.

References

  1. Bullough J, Gu Y, Narendran N, Taylor J (2007) LED life for general lighting: definition of life. Lighting Research Center ASSIST publication. Vol 1, Issue 1, pp 4–5. http://www.lrc.rpi.edu/programs/solidstate/assist/pdf/ASSIST-LEDLife-revised2007.pdf. Accessed 5 Mar 2012

  2. United States Department of Energy (2009) Program requirements for SSL luminaires. Version 1.1, pp 3–4. http://www.energystar.gov/ia/partners/product_specs/program_reqs/SSL_prog_req_V1.1.pdf. Accessed 5 Mar 2012

  3. Seoul Semiconductor (2008) Life time graph of Z-Power LED. pp 7. http://www.symmetron.ru/suppliers/seoul/files/pdf/seoul/Z-power/Reliability.pdf. Accessed 5 Mar 2012

  4. Lasance C (2008) Heat spreading: not a trivial problem. Electronics Cooling 14:24–30

    Google Scholar 

  5. Lasance C (2010) How to estimate heat spreading effects in practice. J Electron Packag 132:031004

    Article  Google Scholar 

  6. Moffat R (2008) Modeling air-cooled heat sinks as heat exchangers. Electronics cooling. Vol 14. February Issue http://www.electronics-cooling.com/2008/02/modeling-air-cooled-heat-sinks-as-heat-exchangers/. Accessed 5 Mar 2012

  7. Incropera FP, Dewitt DP (1990) Fundamentals of heat and mass transfer. 3rd Edition, Wiley, pp 496–502

    Google Scholar 

  8. Teertstra P, Yovanovich MM, Culham JR (2000) Natural convection modeling of heat sinks using web based tools. Electronics Cooling. Vol 6. Sept Issue http://www.electronics-cooling.com/2000/09/natural-convection-modeling-of-heat-sinks-using-web-based-tools/. Accessed 5 Mar 2012

  9. Electronics Cooling Buyers Guide (2012) http://www.electronics-cooling.com/buyers-guide-d-h/#Anchor29. Accessed 5 Mar 2012

  10. Glezer A, Amitay M (2002) Synthetic jets. Ann Rev Fluid Mech 34:503

    Article  MathSciNet  Google Scholar 

  11. Smith BL, Glezer A (1998) The formation and evolution of synthetic jets. Phys Fluids 10(9):2281–2297

    Article  MathSciNet  MATH  Google Scholar 

  12. Gosline JE, O’Brien MP (1934) The water jet pump. U of California Publ Engrg 3(3):167–190

    Google Scholar 

  13. Mahalingam R, Rumigny N, Glezer A (2004) Thermal management using synthetic jet ejectors. IEEE Trans Compon Packag Technol 27(3):439–444

    Article  Google Scholar 

  14. Mahalingam R (2007) Modeling of synthetic jet ejectors for electronics cooling. 23rd Annual IEEE SEMI-THERM Symposium, pp 196–199

    Google Scholar 

  15. Mahalingam R, Glezer A (2005) Design and thermal characteristics of a synthetic jet ejector heat sink. J Electron Packag 127(1):172–177

    Article  Google Scholar 

  16. Gnielinski V (1976) New equations for heat transfer in turbulent pipe and channel flow. Int Chem Eng 16:359–368

    Google Scholar 

  17. Yoo JH, Hong JI, Cao W (2000) Piezoelectric ceramic bimorph coupled to thin metal plate as cooling fan for electronic devices. Sens Actuators 79:8–12

    Article  Google Scholar 

  18. Kimber M, Garimella SV, Raman A (2007) Local heat transfer coefficients induced by piezoelectrically actuated vibrating cantilevers. ASME J Heat Transfer 129(9):1168–1176

    Article  Google Scholar 

  19. Açιkalιn T, Wait SM, Garimella SV, Raman A (2004) Experimental investigation of the thermal performance of piezoelectric fans. Heat Transf Eng 25(1):4–14

    Article  Google Scholar 

  20. Açιkalιn T, Garimella SV, Raman A, Petroski J (2007) Characterization and optimization of the thermal performance of miniature piezoelectric fans. Int J Heat Fluid Flow 28(4):806–820

    Article  Google Scholar 

  21. Kimber M, Garimella SV (2009) Measurement and prediction of the cooling characteristics of a generalized vibrating piezoelectric fan. Int J Heat Mass Transf 52:4470–4478

    Article  Google Scholar 

  22. Kimber M, Suzuki K, Kitsunai N, Seki K, Garimella SV (2009) Flow rate and pressure characteristics of piezoelectric fans. IEEE Compon Packag Technol 32(4):766–775

    Article  Google Scholar 

  23. Sauciuc I (2007) Piezo actuators for electronics cooling. Electronics Cooling, February Issue, Vol 13. http://www.electronics-cooling.com/2007/02/piezo-actuators-for-electronics-cooling/. Accessed 5 Mar 2012

  24. Sarpkaya T (1977) In-line and transverse forces on cylinders in oscillatory flow at high Reynold’s numbers. J Ship Res 21:200–216

    Google Scholar 

  25. Cooling Fans Overview (2012) http://www.orientalmotor.com/technology/articles/cooling-fans-overview.html. Accessed 5 Mar 2012

  26. Jewell-Larsen NE, Ran H, Zhang Y, Schwiebert M, Honer KA, Mamishev AV (2009) Electrohydrodynamically cooled laptop. 25th IEEE SEMI-THERM Symposium, pp 261–266

    Google Scholar 

  27. Jewell-Larsen NE, Karpov SV, Krichtafovitch IA, Jayanty V, Hsu CP, Mamishev AV (2008) Modeling of corona-induced electrohydrodynamic flow with COMSOL multiphysics. Proc. ESA Annual Meeting on Electrostatics, Paper E1

    Google Scholar 

  28. Jewell-Larsen NE, Tran E, Krichtafovitch IA, Mamishev AV (2006) Design and optimization of electrostatic air pumps. IEEE Trans Dielectr Electr Insul 13(1):191–2003

    Article  Google Scholar 

  29. Schlitz DJ, Garimella SV, Fisher TS (2004) Microscale ion-driven air flow over a flat plate. Proceedings of ASME heat transfer/fluids engineering summer conference, pp 463–468

    Google Scholar 

  30. Jewell-Larsen NE, Hsu CP, Krichtafovitch IA, Montgomery SW, Dibene JT, Mamishev AV (2008) CFD analysis of electrostatic fluid accelerators for forced convection cooling. IEEE Trans Dielectr Electr Insul 15(6):1745–1753

    Article  Google Scholar 

  31. Go D, Tirumala R (2012) Ionic winds—a new frontier for air cooling. To appear in Electronics Cooling, Spring Electronics Cooling, March 2012. http://www.electronics-cooling.com/2012/03/ionic-winds-a-new-frontier-for-air-cooling/. Accessed May 29, 2013

  32. Noska B, Jin H, Mahalingam R (2010) Enabling new LED designs through advanced cooling technology. 26rd Annual IEEE SEMI-THERM Symposium, pp 305–310

    Google Scholar 

  33. Tian Xijin (2006) Cooling fan reliability: failure criteria, accelerated life testing, modeling and qualification. Annual reliability and maintainability symposium, pp 380–384

    Google Scholar 

  34. Schwickert M (2012) Synthetic jet thermal management technology increases led lighting system reliability. IEEE Reliability Society Annual Activities Report. http://rs.ieee.org/images/files/Publications/2009/2009-12.pdf. Accessed Mar 5 2012

Download references

Acknowledgments

Section on Piezoelectric fans contributed by Mark Kimber, University of Pittsburgh.

Author information

Authors and Affiliations

Authors

Corresponding author

Correspondence to Raghav Mahalingam PhD .

Editor information

Editors and Affiliations

Rights and permissions

Reprints and permissions

Copyright information

© 2014 Springer Science+Business Media New York

About this chapter

Cite this chapter

Mahalingam, R. (2014). Air Cooling for LED Lighting. In: Lasance, C., Poppe, A. (eds) Thermal Management for LED Applications. Solid State Lighting Technology and Application Series, vol 2. Springer, New York, NY. https://doi.org/10.1007/978-1-4614-5091-7_7

Download citation

  • DOI: https://doi.org/10.1007/978-1-4614-5091-7_7

  • Published:

  • Publisher Name: Springer, New York, NY

  • Print ISBN: 978-1-4614-5090-0

  • Online ISBN: 978-1-4614-5091-7

  • eBook Packages: EngineeringEngineering (R0)

Publish with us

Policies and ethics