Abstract
This chapter describes possible future development directions of solid-state lighting from a high-level materials, devices, and system applications perspective. Since solid-state lighting is likely the highest volume future LED application and is a completely new form of lighting technology, advances in semiconductor and packaging materials, LED devices, and new lighting systems designs are convolved with the evolution of business models and new capabilities brought by new corporate entrants to the rapidly evolving global solid-state lighting business. Examining the development of future LED applications is, therefore, complicated, and it is helpful to briefly set the stage with a brief review of current and emerging LED technology trends and applications.
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Notes
- 1.
Droop refers to the drop in LED light production efficiency with increasing current density common in GaN based LEDs, particularly longer wavelength blue and green LEDs. The droop effect is different from efficiency reduction caused by LED heating due to higher operating current which can be minimized through adequate thermal design.
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Acknowledgments
The author would like to thank colleagues at Rensselaer Polytechnic Institute, Boston University and the University of New Mexico participating in the Smart Lighting Engineering Research Center (ERC) for extensive discussions relating to the future development of solid-state lighting systems and applications. This work has also been shaped by extensive discussions with many of the solid-state lighting industry members of the Smart Lighting ERC who are actively involved in developing new systems-level solutions based on advanced LED technology. This work was supported primarily by the ERC Program of the National Science Foundation under NSF Cooperative Agreement No. EEC-0812056 and in part by New York State under NYSTAR contract C090145.
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Karlicek, R. (2014). Future Directions in LED Applications. In: Lasance, C., Poppe, A. (eds) Thermal Management for LED Applications. Solid State Lighting Technology and Application Series, vol 2. Springer, New York, NY. https://doi.org/10.1007/978-1-4614-5091-7_16
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