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Delaminated Film Buckling Microchannels

Chapter

Abstract

This chapter describes the method of manufacturing microfluidic microchannels formed by delaminated buckled thin films. Thin films under compression tend to delaminate and buckle. Microchannel geometry can be controlled by tailoring film residual stress and placing patterned adhesion-weakening layers utilizing photolithographic techniques. Results based on the photoresist as the adhesion weakening layer and compressed tungsten thin films are described along with the corresponding thin film mechanics.

Keywords

Residual Stress Compressive Residual Stress Strain Energy Release Rate Spin Speed Film Stress 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Springer Science+Business Media New York 2013

Authors and Affiliations

  1. 1.Department of Mechanical EngineeringUniversity of South FloridaTampaUSA

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