Abstract
Due to its excellent ferroelectric properties, lead zirconate titanate (PZT) is widely used for both sensing and actuation components in microelectromechanical systems (MEMS). The development of residual stress during thermal processing of PZT can be a major reliability issue and can often result in thin film failure. For this work, the mechanical material behavior of sol–gel PZT thin films is investigated using digital image correlation to determine the effects of surface adhesion and stabilizing chemical additives. Specifically, for each PZT sol–gel variation, the strain development, failure strain, and cracking response are determined as a function of thermal loading.
This is a preview of subscription content, log in via an institution.
Buying options
Tax calculation will be finalised at checkout
Purchases are for personal use only
Learn about institutional subscriptionsReferences
Yi G, Sayer M (1996) An acetic acid/water based sol–gel PZT process I: modification of Zr and Ti alkoxides with acetic acid. J Sol–Gel Sci Technol 6:65–74
Xia C, Hutchinson J (2000) Crack patterns in thin films. J Mech Phys Solids 48:1107–1131
Hutchinson J, Suo Z (1992) Mixed mode cracking in layered materials. Adv Appl Mech 29:126–137
Beuth J (1992) Cracking of thin bonded films in residual tension. Int J Solids Struct 29:1657–1675
Yow H, Goikoetxea M, Goehring L, Routh A (2010) Effect of film thickness and particle size on cracking stresses in drying latex films. J Colloid Interface Sci 352:542–548
Pan B, Qian K, Xie H, Asundi A (2009) Two-dimensional digital image correlation for in-plane displacement and strain measurement: a review. Meas Sci Technol 20:1–17
Dally J, William R (2005) Experimental stress analysis. College House Enterprises, Knoxville
Yi G, Sayer M (1988) Preparation of Pb(Zr, Ti)O3 thin films by sol–gel processing: electrical, optical, and electro-optic properties. J Appl Phys 64:2717–2724
Author information
Authors and Affiliations
Corresponding author
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 2013 The Society for Experimental Mechanics, Inc.
About this paper
Cite this paper
Meuris, B.J., Berfield, T.A. (2013). Thermal Analysis of PZT Thin Films Using Digital Image Correlation. In: Jin, H., Sciammarella, C., Furlong, C., Yoshida, S. (eds) Imaging Methods for Novel Materials and Challenging Applications, Volume 3. Conference Proceedings of the Society for Experimental Mechanics Series. Springer, New York, NY. https://doi.org/10.1007/978-1-4614-4235-6_40
Download citation
DOI: https://doi.org/10.1007/978-1-4614-4235-6_40
Published:
Publisher Name: Springer, New York, NY
Print ISBN: 978-1-4614-4234-9
Online ISBN: 978-1-4614-4235-6
eBook Packages: EngineeringEngineering (R0)