Abstract
This paper focuses on the microlithography technique. Its main steps are described as well as its key difficulties in order to clarify the technique potential. The microgrid dimension limits and the experimental procedure enabling digital image correlation are also presented to widen their application. The microgrid characteristics needed for Electron BackScattering Diffraction measurements are also discussed. The settings provided here enable the coupling of full-field strain measurement information with Electron BackScattering Diffraction analysis not only before deformation but also during the tensile test.
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© 2013 The Society for Experimental Mechanics, Inc.
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Marteau, J., Haddadi, H., Bouvier, S. (2013). Microlithography Technique Advantages, Limits and Its Coupling with EBSD Measurements. In: Jin, H., Sciammarella, C., Furlong, C., Yoshida, S. (eds) Imaging Methods for Novel Materials and Challenging Applications, Volume 3. Conference Proceedings of the Society for Experimental Mechanics Series. Springer, New York, NY. https://doi.org/10.1007/978-1-4614-4235-6_39
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DOI: https://doi.org/10.1007/978-1-4614-4235-6_39
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