Abstract
The concept of temporarily thermal relaxation is extended theoretically to assess the film residual stress. First, the contribution of the initial stress to the observable displacement field is separated with eliminating the thermal expansion effect of the material. Then, the residual stress is inversely derived through the displacement increment. Finally, finite element analysis was carried out to provide numerical description of the partial relieve of the residual stress.
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Acknowledgements
This work was supported by the National Natural Science Foundation of China (Grant No. 11002145).
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© 2013 The Society for Experimental Mechanics, Inc.
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Cheng, XX., Wu, CW. (2013). Film Residual Stress Assessment Method via Temporarily Thermal Relaxation. In: Ventura, C., Crone, W., Furlong, C. (eds) Experimental and Applied Mechanics, Volume 4. Conference Proceedings of the Society for Experimental Mechanics Series. Springer, New York, NY. https://doi.org/10.1007/978-1-4614-4226-4_31
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DOI: https://doi.org/10.1007/978-1-4614-4226-4_31
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