Over the last decade, the semiconductor industry has experienced phenomenal growth, which has resulted in unprecedented research and technological developments in numerous domains of science and engineering. As per Moore’s Law, the emergence of the nanometer generation of very-large scale integrated (VLSI) systems has led to chip densities of over a million transistors per square millimeter, which can operate at extremely high frequencies. This rapid growth has culminated in significant performance gains and breakthroughs in a plethora of fields ranging from advanced computing platforms, to communication, security, healthcare, biomedical systems and ultra-low power devices such as wireless micro-sensors. However, this tremendous growth has incurred extremely high levels of power dissipation, resulting in an energy crisis in modern ICs. High power dissipation levels also leads to significant heat generation, increasing risk of transistor breakdown effects. This places a tremendous stress on corresponding cooling and packaging solutions, thereby adding to size, cost and weight of the entire system. Moreover, the energy crisis is further exacerbated by a much slower pace in battery technology development.
KeywordsOutput Voltage Energy Harvesting Power Management Charge Pump Power Converter
- 5.Simunic T, Benini L, Acquaviva A, Glynnnad P, DeMicheli G (2001) Dynamic voltage scaling and power management for portable systems. In: Proceedings of design automation conference (DAC), pp 524–529Google Scholar
- 9.Raghunathan V, Kansal A, Hsu J, Friedman J, Srivastava M (2005) Design considerations for solar energy harvesting wireless embedded systems. In: 4th International symposium on information processing in sensor networks, pp 457–462Google Scholar
- 18.Snyder GJ (2008) Small thermoelectric generators. Electrochem Soc Interface 17(3):54–56Google Scholar
- 20.Duggirala R, Lai A, Polcawich RG, Dubey M (2006) CMOS compatible multiple power-output MEMS radioisotope μ-power generator. In: IEEE International Electron Devices Meeting, pp 1–4Google Scholar