Abstract
A smart flow sensor capable of measuring two distinct gas flows with two different linearity ranges is proposed. The device is based on a chip, designed with a commercial CMOS process, which includes different sensing structures and a read-out interface. The chip is fabricated applying a post-processing technique based on a silicon anisotropic etching in a TMAH solution. A simple and low cost packaging technique is used to convey two distinct gas flows to two selected sensing structures by means of channels of different cross sections. Three methods for sealing the interface between the chip and the gas conveyor are proposed and discussed.
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References
Van Oudheusden BW (1992) Silicon thermal flow sensors. Sens Actuat A 30:5–26
Ashauer M, Glosch H, Hedrich F, Hey N, Sandmaier H, Lang W (1999) Thermal flow sensor for liquids and gases based on combinations of two principles. Sen Actuat A 73:7–13
Beeby S, Ensell G, Kraft M, White N (2004) MEMS mechanical sensors, 1st edn. Artech House, Boston
Bruschi P, Nurra V, Piotto M (2008) A compact package for integrated silicon thermal gas flow meters. Microsyst Technol 14:943–949
Bruschi P, Dei M, Piotto M (2009) A single chip, double channel thermal flow meter. Microsyst Technol 15:1179–1186
Elwenspoek M, Wiegerink R (2001) Mechanical microsensors, 1st edn. Springer, Berlin
Bruschi P, Dei M, Piotto M (2011) An offset compensation method with low residual drift for integrated thermal flow sensors. IEEE Sens J 11:1162–1168
Bruschi P, Piotto M (2012) Design issues for low power integrated thermal flow sensors with ultra-wide dynamic range and low insertion loss. Micromachines 3(2):295–314
Bruschi P, Piotto M, Bacci N (2009) Postprocessing, readout and packaging methods for integrated gas flow sensors. Microelectron J 40:1300–1307
Bruschi P, Dei M, Piotto M (2009) A low-power 2-D wind sensor based on integrated flow meters. IEEE Sens J 9:1688–1696
Acknowledgements
The authors thank STMicroelectronics R&D group of Cornaredo (MI) for fabricating the chip.
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Piotto, M., Butti, F., Pennelli, G., Bruschi, P. (2014). Smart Flow Sensors Based on Advanced Packaging Techniques Applied to Single Chip Sensing Devices. In: Baldini, F., et al. Sensors. Lecture Notes in Electrical Engineering, vol 162. Springer, New York, NY. https://doi.org/10.1007/978-1-4614-3860-1_9
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DOI: https://doi.org/10.1007/978-1-4614-3860-1_9
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