Abstract
Surface roughening is a generally accepted way to enhance adhesion between two dissimilar materials. One of the key mechanisms, besides the obvious increase in surface area, is the transition from adhesive to cohesive failure, i.e., crack kinking. This chapter presents several analysis methods to study this phenomenon. First, a semi-analytical approach is discussed in which the competition between adhesive and cohesive cracking is analyzed by means of the theoretical relation between interface and kinking stress intensity factors. Accordingly, the crack kinking location and kinking angle are readily calculated. Second, transient crack propagation simulations are performed to calculate crack paths at a roughened surface by means of cohesive zone elements. Third, delamination experiments are performed on samples containing well-controlled surface roughness profiles.
This is a preview of subscription content, log in via an institution to check access.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
References
Zhang GQ, van Driel WD, Fan XJ (2006) Mechanics of microelectronics. Springer, Berlin
Hu JZ, Yang LQ, Hwang WJ, Shin MW (2006) Thermal and mechanical analysis of delamination in GaN-based light-emitting diode packages. J Cryst Growth 288:157–161
Buehler MJ (2008) Atomistic modeling of materials failure. Springer, New York, NY
Evans AG, Rühle M, Dalgleish BJ, Charalambides PG (1990) The fracture energy of bimaterial interfaces. Mater Sci Eng 126:53–64
Van der Sluis O, Hsu YY, Timmermans PHM, Gonzalez M, Hoefnagels JPM (2011) Stretching induced interconnect delamination in stretchable electronic circuits. J Phys D: Appl Phys 44:034008
Qu J (2003) Thermomechanical reliability of microelectronic packaging. In: Milne I, Ritchie RO, Karihaloo B (eds) Comprehensive Structural Integrity, Pergamon, Oxford, 219–239, ISBN: 9780080437491
Devries KL, Adams DO (2002) Mechanical testing of adhesive joints. In: Dillard DA, Pocius AV (eds) The mechanics of adhesion. Elsevier Science, The Netherlands
Yao Q, Qu J (2002) Interfacial versus cohesive failure on polymer–metal interfaces in electronic packaging effects of interface roughness. J Electron Packaging 124:127–134
Zavattieri PD, Hector LG Jr, Bower AF (2008) Cohesive zone simulations of crack growth along a rough interface between two elastic–plastic solids. Eng Fracture Mech 75:4309–4332
He MY, Hutchinson JW (1989) Kinking of a crack out of an interface. J Appl Mech 111:270–278
Noijen SPM, van der Sluis O, Timmermans PHM, Zhang GQ (2012) A semi-analytic method for crack kinking analysis at isotropic bi-material interfaces. Eng Fracture Mech 83:8–25
Geers MGD (1999) Enhanced solution control for physically and geometrically non-linear problems. Part I – the subplane control approach. Int J Numer Meth Eng 46:177–204
He MY, Hutchinson JW (1989) Kinking of a crack out of an interface: tabulated solution coefficients. Technical report, Harvard University
He MY, Bartlett A, Evans AG, Hutchinson JW (1991) Kinking of a crack out of an interface: role of in-plane stress. J Am Ceram Soc 74:767–771
Jakobsen J, Andreasen JH, Bozhevolnaya E (2008) Crack kinking of a delamination at an inclined core junction interface in a sandwich beam. Eng Fracture Mech 75:4759–4773
Hutchinson JW, Suo Z (1991) Mixed mode cracking in layered materials. Adv Appl Mech 29:63–191
Packham DE (2003) Surface energy, surface topography and adhesion. Int J Adhesion Adhesives 23:437–448
Van Hal BAE, Peerlings RHJ, Geers MGD, van der Sluis O (2007) Cohesive zone modeling for structural integrity analysis of IC interconnects. Microelectron Reliab 47:1251–1261
Yarovsky I (1997) Atomistic simulation of interfaces in materials: theory and applications. Aust J Phys 50:407–424
Hölck O, Bauer J, Wittler O, Land K, Michel B, Wunderle B (2011) Experimental contact angle determination and characterisation of interfacial energies by molecular modelling of chip to epoxy interfaces. In: Proceedings of ECTC 2011, Florida
Prechtel M, Leiva Ronda P, Janisch R, Hartmaier A, Leugering G, Steinmann P, Stingl M (2011) Simulation of fracture in heterogeneous elastic materials with cohesive zone models. Int J Fracture 168:15–29
Charalambides PG, Lund J, Evans AG, McMeeking RM (1989) A test specimen for determining the fracture resistance of bimaterial interfaces. J Appl Mech 56:77–82
Acknowledgments
The authors thank Kaipeng Hu from Eindhoven University of Technology for the failure analyses and Ron Hovenkamp, Will Ansems, and Ed Berben from Philips Research for sample preparation, interface testing, and failure analyses. Furthermore, we thank the European Commission for partial funding of this work under project NanoInterface (NMP-2008-214371).
Author information
Authors and Affiliations
Corresponding author
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 2013 Springer Science+Business Media, LLC
About this chapter
Cite this chapter
van der Sluis, O., Noijen, S.P.M., Timmermans, P.H.M. (2013). On the Effect of Microscopic Surface Roughness on Macroscopic Polymer–Metal Adhesion. In: van Driel, W., Fan, X. (eds) Solid State Lighting Reliability. Solid State Lighting Technology and Application Series, vol 1. Springer, New York, NY. https://doi.org/10.1007/978-1-4614-3067-4_11
Download citation
DOI: https://doi.org/10.1007/978-1-4614-3067-4_11
Published:
Publisher Name: Springer, New York, NY
Print ISBN: 978-1-4614-3066-7
Online ISBN: 978-1-4614-3067-4
eBook Packages: EngineeringEngineering (R0)