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A Multiscale Approach for Interfacial Delamination in Solid-State Lighting

  • H. Fan
  • M. M. F. Yuen
Chapter
Part of the Solid State Lighting Technology and Application Series book series (SSLTA, volume 1)

Abstract

Interfacial delamination is the root cause for many failure modes in electronic devices. Examples are metal shift, wire stitch failures, and die lift. LED packages suffer from delamination as well, mainly due to the fact that transparent materials are needed to pass the light from the device to the surroundings. Using these kinds of materials has a significant impact on the mismatch of material properties. Any gap in the optical pathway will create reflections and, as such, destroy the functionality of the LED package. Therefore, investigation of interfacial delamination is rather important for LED product design. In this paper, we propose a multiscale approach to study delamination in a bi-material structure, which bridges molecular dynamics method and finite element method using cohesive zone model (CZM). CZM parameters were derived from an interfacial MD model under mechanical loading and were assigned to the cohesive zone element representing the interfacial behavior. Based on the multiscale model, the material behavior at nanoscale was passed onto the continuum model under tensile loading condition.

Keywords

Molecular Dynamic Simulation Cohesive Zone Cohesive Zone Model Cohesive Element Molecular Dynamic Model 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

Notes

Acknowledgments

The project was supported by the Grant Research Founding 621907.

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Copyright information

© Springer Science+Business Media, LLC 2013

Authors and Affiliations

  1. 1.Philips InnovationShanghaiChina
  2. 2.Department of Mechanical EngineeringHong Kong University of Science and TechnologyHong KongChina

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