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An On-Chip Temperature Sensor for the Measurement of RF Power Dissipation and Thermal Gradients

  • Marvin Onabajo
  • Jose Silva-Martinez
Chapter

Abstract

In this chapter, a design methodology is presented that aims at the extraction of RF circuit performance characteristics from the DC output of an on-chip temperature sensor. Any RF input signal can be applied to excite the circuit under examination because only dissipated power levels are measured, which makes this approach attractive for online thermal monitoring and built-in test scenarios. A fully-differential sensor topology is introduced that has been specifically designed for this method by constructing it with a wide dynamic range, programmable sensitivity to DC and RF power dissipation, as well as compatibility with CMOS technology. Furthermore, a procedure is outlined to model the local electro-thermal coupling between heat sources and the sensor, which is used to define the temperature sensor’s specifications as well as to predict the thermal signature of the circuit under test.

Keywords

Power Dissipation Circuit Under Test Input Power Level Sensor Circuit Sensor Core 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Springer Science+Business Media New York 2012

Authors and Affiliations

  • Marvin Onabajo
    • 1
  • Jose Silva-Martinez
    • 2
  1. 1.Department of Electrical and Computer Engineering, 409 Dana Research CenterNortheastern UniversityBostonUSA
  2. 2.Department of Electrical and Computer EngineeringTexas A&M UniversityCollege StationUSA

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