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Process Variation Challenges and Solutions Approaches

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Analog Circuit Design for Process Variation-Resilient Systems-on-a-Chip

Abstract

The technical and economic impacts of worsening process variations and intra-die device mismatches are elaborated in this chapter, especially with regards to product yield, reliability, and manufacturing cost. This introduction is followed by a survey of diverse built-in testing and calibration approaches aimed at enhancing performance, yield, and reliability in the presence of variations.

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Authors and Affiliations

  1. Department of Electrical and Computer Engineering, 409 Dana Research Center, Northeastern University, 360 Huntington Avenue, Boston, MA, 02115, USA

    Marvin Onabajo

  2. Department of Electrical and Computer Engineering, Texas A&M University, 111A Zachry Engineering Building, College Station, TX, 77843-3128, USA

    Jose Silva-Martinez

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  1. Marvin Onabajo
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  2. Jose Silva-Martinez
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Onabajo, M., Silva-Martinez, J. (2012). Process Variation Challenges and Solutions Approaches. In: Analog Circuit Design for Process Variation-Resilient Systems-on-a-Chip. Springer, Boston, MA. https://doi.org/10.1007/978-1-4614-2296-9_2

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  • DOI: https://doi.org/10.1007/978-1-4614-2296-9_2

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