Skip to main content

Abstract

This chapter introduces the technical challenges associated with increasing variations as a result from scaling down the dimensions of devices fabricated with complementary metal-oxide-semiconductor (CMOS) technology. The incentives for further improvements of variation-aware design and testing techniques are also highlighted. Finally, the chapter contains an overview of the scope and organization of this book.

This is a preview of subscription content, log in via an institution to check access.

Access this chapter

Chapter
USD 29.95
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
eBook
USD 84.99
Price excludes VAT (USA)
  • Available as EPUB and PDF
  • Read on any device
  • Instant download
  • Own it forever
Softcover Book
USD 109.99
Price excludes VAT (USA)
  • Compact, lightweight edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info
Hardcover Book
USD 109.99
Price excludes VAT (USA)
  • Durable hardcover edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info

Tax calculation will be finalised at checkout

Purchases are for personal use only

Institutional subscriptions

References

  1. International Technology Roadmap for Semiconductors, Test and Test Equipment, 2009 edn. Available: http://public.itrs.net/reports.html

  2. S. Menon, C.L. Horney, Smartphone & Chip Market Opportunities, Market research report no. 9010, Forward Concepts Co., Available: http://fwdconcepts.com/Smartphones. 5 Feb 2009

Download references

Author information

Authors and Affiliations

Authors

Rights and permissions

Reprints and permissions

Copyright information

© 2012 Springer Science+Business Media New York

About this chapter

Cite this chapter

Onabajo, M., Silva-Martinez, J. (2012). Introduction. In: Analog Circuit Design for Process Variation-Resilient Systems-on-a-Chip. Springer, Boston, MA. https://doi.org/10.1007/978-1-4614-2296-9_1

Download citation

  • DOI: https://doi.org/10.1007/978-1-4614-2296-9_1

  • Published:

  • Publisher Name: Springer, Boston, MA

  • Print ISBN: 978-1-4614-2295-2

  • Online ISBN: 978-1-4614-2296-9

  • eBook Packages: EngineeringEngineering (R0)

Publish with us

Policies and ethics