Skip to main content

Overview of Traditional Thermal Management Materials

  • Chapter
  • First Online:
Advanced Thermal Management Materials

Abstract

In this chapter, we will present an overview of traditional thermal management materials. First, we will review the properties of Al2O3 dielectric materials and their applications in thick-film circuit substrate, thin-film circuit substrate, and multilayer substrate. Next, we will present the properties of Al2O3, BeO, AlN, SiC, and mullite and their manufacturing methods. In the following section, we will introduce traditional polymer-based thermal management materials, such as epoxy, silicone rubber, and polyimide. Finally, we will introduce pure metal or alloy traditional thermal management materials such as Cu, Al, W, Mo, and Kovar and their manufacturing methods.

This is a preview of subscription content, log in via an institution to check access.

Access this chapter

Chapter
USD 29.95
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
eBook
USD 84.99
Price excludes VAT (USA)
  • Available as EPUB and PDF
  • Read on any device
  • Instant download
  • Own it forever
Softcover Book
USD 109.99
Price excludes VAT (USA)
  • Compact, lightweight edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info
Hardcover Book
USD 109.99
Price excludes VAT (USA)
  • Durable hardcover edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info

Tax calculation will be finalised at checkout

Purchases are for personal use only

Institutional subscriptions

References

  1. Harper CA (2005) Electronic materials and processes handbook, 3rd edn. McGraw-Hill, New York

    Google Scholar 

  2. Zhou L (2006) Microelectronic device packaging materials and packaging technology package. Chemical Industry Press, Beijing

    Google Scholar 

  3. Carl ZM et al (1992) Matrix composites for electronic packaging. JOM 44(7):15–23

    Article  Google Scholar 

  4. Carl Z (1998) Advances in composite materials for thermal management in electronic packaging. JOM 50(6):47–51

    Article  MathSciNet  Google Scholar 

  5. Junjun C, Yuepeng F, Mingbo T (2008) The latest progress in microelectronic packaging materials. Semicond Technol 33(3):185–189

    Google Scholar 

  6. Tian M (2003) Electronic packaging engineering. Tsinghua University Press, Beijing

    Google Scholar 

  7. Hodson TL (1995) A lN steps up takes the heat and delivers. Elect Packag Prod 35(7):26–30

    Google Scholar 

  8. Liang Q, Zhou HP, Fu RL et al (2003) Thermal conductivity of AlN ceramics sintered with CaF2 and YF3. Ceram Int 29:893–897

    Article  Google Scholar 

  9. Larson SE, Slaby J (2004) Comparison of various substrate technologies under steady state and transient conditions. Integr Electron Syst Sector 2:648–653

    Google Scholar 

  10. Vaed K, Florkey J, Akbar SA et al (2004) An additive micromolding approach for the development of micromachined ceramic substrates for RF applications. J Microelectron Mech Syst 30(13):514–521

    Article  Google Scholar 

  11. Li XL, Ma HA, Zuo GH et al (2007) Low temperature sintering of high density aluminium nitride ceramics without additives at high pressure. Scipta Mater 56(12):1015–1018

    Google Scholar 

  12. Zaosheng Z, Zhengya L, Zhiwu C (2008) Ceramic substrates for electronic packaging materials. Mater Guide 22(11):16–20

    Google Scholar 

  13. Gorbunova MA, Shein IR (2007) Electronic and magnetic properties of beryllium oxide with 3d impurities from first principles calculations. Phys B Condens Matter 1:47–52

    Article  Google Scholar 

  14. Zhou Q (2009) LTCC technology development and trend. Chinese Electron J l(4): 25–26

    Google Scholar 

  15. Guifang X, Xiaonong C, Wei X et al (2008) Epoxy/ZrW2O8 preparation and properties of packaging materials. J Jiangsu Univ 25(3):223–226

    Google Scholar 

  16. Wenying H (2008) Performance improvement of electronic packaging materials. Appl Science Technol 22(16):15–20

    Google Scholar 

Download references

Author information

Authors and Affiliations

Authors

Corresponding author

Correspondence to Guosheng Jiang .

Rights and permissions

Reprints and permissions

Copyright information

© 2013 Springer Science+Business Media New York

About this chapter

Cite this chapter

Jiang, G., Diao, L., Kuang, K. (2013). Overview of Traditional Thermal Management Materials. In: Advanced Thermal Management Materials. Springer, New York, NY. https://doi.org/10.1007/978-1-4614-1963-1_3

Download citation

  • DOI: https://doi.org/10.1007/978-1-4614-1963-1_3

  • Published:

  • Publisher Name: Springer, New York, NY

  • Print ISBN: 978-1-4614-1962-4

  • Online ISBN: 978-1-4614-1963-1

  • eBook Packages: EnergyEnergy (R0)

Publish with us

Policies and ethics