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Overview of Traditional Thermal Management Materials

Chapter

Abstract

In this chapter, we will present an overview of traditional thermal management materials. First, we will review the properties of Al2O3 dielectric materials and their applications in thick-film circuit substrate, thin-film circuit substrate, and multilayer substrate. Next, we will present the properties of Al2O3, BeO, AlN, SiC, and mullite and their manufacturing methods. In the following section, we will introduce traditional polymer-based thermal management materials, such as epoxy, silicone rubber, and polyimide. Finally, we will introduce pure metal or alloy traditional thermal management materials such as Cu, Al, W, Mo, and Kovar and their manufacturing methods.

Keywords

High Thermal Conductivity Ceramic Substrate Epoxy Molding Compound Sinter Agent Electronic Packaging Material 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Springer Science+Business Media New York 2013

Authors and Affiliations

  1. 1.College of Materials Science and EngineeringCentral South UniversityChangshaChina
  2. 2.Brewer ScienceSpringfieldUSA
  3. 3.Torrey Hills TechnologiesSan DiegoUSA

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