Overview of Traditional Thermal Management Materials



In this chapter, we will present an overview of traditional thermal management materials. First, we will review the properties of Al2O3 dielectric materials and their applications in thick-film circuit substrate, thin-film circuit substrate, and multilayer substrate. Next, we will present the properties of Al2O3, BeO, AlN, SiC, and mullite and their manufacturing methods. In the following section, we will introduce traditional polymer-based thermal management materials, such as epoxy, silicone rubber, and polyimide. Finally, we will introduce pure metal or alloy traditional thermal management materials such as Cu, Al, W, Mo, and Kovar and their manufacturing methods.


High Thermal Conductivity Ceramic Substrate Epoxy Molding Compound Sinter Agent Electronic Packaging Material 
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Copyright information

© Springer Science+Business Media New York 2013

Authors and Affiliations

  1. 1.College of Materials Science and EngineeringCentral South UniversityChangshaChina
  2. 2.Brewer ScienceSpringfieldUSA
  3. 3.Torrey Hills TechnologiesSan DiegoUSA

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