Abstract
Here we demonstrate the application of the SED failure criterion to a “real-life” engineering problem involving thermoelasticity effects in a microscale electronic device discussed in [205]. The fabrication of microelectronic devices (chips) is a multistep process aimed at creating a layered structure made of semiconductors, metals, and insulators.
This is a preview of subscription content, log in via an institution to check access.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
Preview
Unable to display preview. Download preview PDF.
Author information
Authors and Affiliations
Rights and permissions
Copyright information
© 2012 Springer Science+Business Media, LLC
About this chapter
Cite this chapter
Yosibash, Z. (2012). A Thermoelastic Failure Criterion at the Micron Scale in Electronic Devices. In: Singularities in Elliptic Boundary Value Problems and Elasticity and Their Connection with Failure Initiation. Interdisciplinary Applied Mathematics, vol 37. Springer, New York, NY. https://doi.org/10.1007/978-1-4614-1508-4_9
Download citation
DOI: https://doi.org/10.1007/978-1-4614-1508-4_9
Published:
Publisher Name: Springer, New York, NY
Print ISBN: 978-1-4614-1507-7
Online ISBN: 978-1-4614-1508-4
eBook Packages: Mathematics and StatisticsMathematics and Statistics (R0)