Abstract
Assembly manufacturing processes can be broken into front of line (FOL) and end of line (EOL) components, each having several process steps.
In FOL, typical processes include the wafer handling process, die pickup from tape that becomes more of a problem as die thinning becomes more extreme. FOL die attach processes can induce residual stresses due to process shrinkage and CTE mismatch. Wire bonding processes can induce bond pad cratering or failure in the device under bond pad. In EOL, typical processes include molding process with curing stress and residual stress, molding ejection, and clamping process that can potentially cause cracking in molding compound, trim and form and singulation process that would induce the stress wave to crack the die or the EMC. Before the actual assembly process, the virtual modeling and analysis is very important to find out the optimized solution and failure mode which can extremely benefit to enhance the quality and reliability of the power packaging, especially for new product development.
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Liu, Y. (2012). Power Package Typical Assembly Process. In: Power Electronic Packaging. Springer, New York, NY. https://doi.org/10.1007/978-1-4614-1053-9_8
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DOI: https://doi.org/10.1007/978-1-4614-1053-9_8
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