Abstract
The development of the power IC package is a dynamic technology. Power IC Applications that were unattainable only a few years ago are today commonplace thanks in part to advances in electronic package design. From portable applications such as in mobile telecommunications and consumer electronics to aerospace and automotive applications, each imposes its own individual demands on the electronic package. To meet such a diverse range of application requirements, IC package range encompasses over 30 different types, most of which are subdivided into a number of outline versions. The power IC packages offers a high thermal dissipation, enabling power IC usage in some of the most demanding application areas which integrate analog, logic, and power MOSFETs (Challenges of power electronic packaging and modeling, 2011; Trends in analog and power packaging, 2009).
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References
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Liu, Y. (2012). Power IC Package Design and Analysis. In: Power Electronic Packaging. Springer, New York, NY. https://doi.org/10.1007/978-1-4614-1053-9_4
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DOI: https://doi.org/10.1007/978-1-4614-1053-9_4
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