Abstract
Chapter 4 deals with low cycle fatigue tests and derivation of fatigue life prediction models curve-fitted to the fatigue test data for Sn–Ag–Cu and Sn–Cu solder alloys. The fatigue tests were conducted under low cycle fatigue test conditions over a wide range of isothermal temperatures (−40°C to +125°C) and frequencies. Both the strain-range and energy-based low cycle fatigue models were used. The fatigue life prediction model constants are presented in tables and closed-form equations for easy use to predict the solder joint fatigue life when the inelastic strain range or inelastic strain energy density fatigue driving force parameter is obtained from an FEA result.
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ASTM Standards (1998) ASTM E606: standard practice for strain-controlled fatigue testing, vol 03.01. The American Society for Testing and Materials, Philadelphia, PA
Pang HLJ, Xiong BS, Low TH (2004) Low cycle fatigue models for lead free solders. Thin Solid Film 462–463:408–412
John HLP, Xiong BS, Low TH (2004) Low cycle fatigue of lead-free 99.3Sn-0.7Cu solder alloy. Int J Fatigue 26:865–872
Shi XQ, Pang HLJ, Zhou W, Wang ZP (2000) Low cycle fatigue analysis of temperature and frequency effects in eutectic solder alloy. Int J Fatigue 22:217–228
Kanchanomai C, Miyashita Y, Mutoh Y (2002) Low cycle fatigue behavior of lead-free solder 96.5Sn/3.5Ag. J Electron Mater 31:142
Kanchanomai C, Miyashita Y, Mutoh Y (2002) Low cycle fatigue behavior of Sn-Ag, Sn-Ag-Cu and Sn-Ag-Cu-Bi lead-free solders. J Electron Mater 31:456
Mavoori H, Vaynman S, Chin J, Moran B, Fine ME (1994) Isothermal fatigue life prediction of solder materials. In: Mechanics and materials for electronic packaging. ASME, New York, pp 165–179
Kariya Y, Otsuka M (1998) Mechanical fatigue characteristics of Sn-3.5Ag-X(X = Bi, Cu, Zn and in) solder alloys. J Electron Mater 27:1229
Pang JHL, Xiong BS (2004) Comparison of 5.5Sn-3.8Ag-0.7Cu solder joint and bulk solder properties. TMS 2004, 133rd annual meeting and exhibition, Charlotte, North Carolina, USA, 14–18 March 2004
Pang HLJ, Xiong BS, Low TH (2004) Creep and fatigue properties of lead free Sn-3.8Ag-0.7Cu solder. Proceedings of 54th ECTC, vol 2, Las Vegas, 1–4 June 2004, pp 1333–1337
Coffin LF (1954) A study of the effects of cyclic thermal stresses on a ductile metal. Trans ASME 76:931
Manson SS (1965) Fatigue a complex subject-some simple approximations. Exp Mech 5:193–226
Morrow JD (1964) Cyclic plastic strain energy and fatigue of metals, ASTM STP 378. American Society for Testing and Materials, Philadelphia, PA, p 45
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Pang, J.H.L. (2012). Fatigue Life Prediction Models. In: Lead Free Solder. Springer, New York, NY. https://doi.org/10.1007/978-1-4614-0463-7_4
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DOI: https://doi.org/10.1007/978-1-4614-0463-7_4
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