Abstract
Chapter 3 reports on experimental tests to characterize the mechanical properties for the apparent elastic modulus, yield stress, and ultimate tensile strength. These mechanical properties are highly dependent on test temperature and test strain rate. For high strain-rate test conditions, a Split-Hopkinson pressure bar (SHPB) test method was employed for measuring strain-rate influence on the yield stress of lead-free solder material. Comparisons of these mechanical properties were made for Sn–Ag–Cu, Sn–Cu, and Sn–Pb solder alloys. Strain rate and temperature-dependent mechanics of material models were curve-fitted for the range of temperatures (−40°C to +125°C) and strain-rates (0.0001–1,000 s−1) tested. Creep tests results are presented in steady state creep models. A rate dependent viscoplastic deformation model by Anand, was fitted to the test data from the creep test and tensile test of Sn–Ag–Cu, Sn–Cu, and Sn–Pb solder alloys.
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Pang, J.H.L. (2012). Mechanical Properties and Constitutive Models. In: Lead Free Solder. Springer, New York, NY. https://doi.org/10.1007/978-1-4614-0463-7_3
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DOI: https://doi.org/10.1007/978-1-4614-0463-7_3
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