Advertisement

Introduction

  • John Hock Lye Pang
Chapter

Abstract

Chapter 1 provides an introduction on the use and application of lead- free solders in the semiconductor packaging and electronics manufacturing industry. The importance of solder joint reliability testing and assessments is described within a framework of a DFR methodology. This DFR methodology provides a systematic approach to understanding the mechanics of deformation of solder materials, characterizing the mechanical properties, constitutive models for creep and viscoplastic analysis, fatigue life prediction models, which are then employed in a finite element modeling and simulation analysis to assess the solder joint reliability performance.

Keywords

Fatigue 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

References

  1. 1.
    European Parliament (2003) Directive 2002/95/EC on the restriction of the use of certain hazardous substances in electrical and electronic equipment. Official J Eur Union, pp L37/19–L37/23Google Scholar
  2. 2.
    European Parliament (2003) Directive 2002/96/EC on waste of electrical and electronic equipment. Official J Eur Union, pp L37/24-L37/38Google Scholar
  3. 3.
    NEMI, National Electronics Manufacturers Initiative. (http://www.nemi.org)
  4. 4.
    Schubert A, Pang JHL (2002) Lead free solder materials and reliability performance. Short course notes at 4th electronics packaging technology conference, lead-free workshop, 10 Dec 2002Google Scholar
  5. 5.
    Pang JHL, Wong SCK, Wang ZP, Guest Editors (2002) Lead-free and lead-bearing solders. Soldering Surface Mount Technol 14(3)Google Scholar
  6. 6.
    Pang JHL, Dudek R (2005) Lead free solder materials and reliability performance. Short course notes at 7th electronics packaging technology conference, 6 Dec 2005Google Scholar
  7. 7.
    Pang JHL (2007) Lead-free solder materials: design for reliability. In: Suhir E, Lee YC, Wong CP (eds) Micro- and opto-electronic materials and structures: physics, mechanics, design, reliability, packaging, vol 1, Materials physics/materials mechanics. Springer, New YorkGoogle Scholar
  8. 8.
    Pang JHL, Low TH, Xiong BS, Che FX (2003) Design for reliability (DFR) methodology for electronic packaging assemblies. Proceedings of 2003 electronics packaging technology conference, pp 470–478Google Scholar
  9. 9.
    Sitaraman SK, Pang JHL (2001) Fundamentals of design for reliability, chapter 5. In: Tummala RR (ed) Fundamentals of microsystems packaging. Mc Graw Hill, New YorkGoogle Scholar
  10. 10.
    Pang JHL, Xiong BS (2005) Mechanical properties for 95.5Sn-3.8Ag-0.7Cu lead free solder alloy. IEEE Trans Components Packaging Technol 28(4):830–840CrossRefGoogle Scholar
  11. 11.
    Pang HLJ, Xiong BS, Neo CC, Zhang XR, Low TH (2003) Bulk solder and solder joint properties for lead free 95.5Sn-3.8Ag-0.7Cu solder alloy. Proceedings of 53rd electronic components and technology conference, New Orleans, Louisiana, USA, 27–30 May 2003, pp 673–679Google Scholar
  12. 12.
    John PHL, Xiong BS, Low TH (2004) Low cycle fatigue models for lead free solders. Thin Solid Film 462–463:408–412Google Scholar
  13. 13.
    Pang HLJ, Xiong BS, Low TH (2004) Creep and fatigue properties of lead free Sn-3.8Ag-0.7Cu solder. Proceedings of 54th ECTC, Las Vegas, vol 2, 1–4 June 2004, pp 1333–1337Google Scholar
  14. 14.
    Pang JHL, Xiong BS, Low TH (2004) Low cycle fatigue of lead-free 99.3Sn-0.7Cu solder alloy. Int J Fatigue 26:865–872Google Scholar
  15. 15.
    Pang JHL, Xiong BS, Low TH (2004) Comprehensive mechanics characterization of lead-free 95.5Sn-3.8Ag-0.7Cu solder. Micromater Nanomater 3:86–93Google Scholar
  16. 16.
    Pang JHL, Xiong BS, Che FX (2004) Modeling stress strain curves for lead-free Sn-3.8Ag-0.7Cu solder. IEEE proceedings of EuroSime 2004 conference, Belgium, 9–12 MayGoogle Scholar
  17. 17.
    Che FX, Pang JHL et al (2005) Lead free solder joint reliability characterization for PBGA, PQFP and TSSOP assemblies. Proceedings of 2005 electronic components and technology conference, 55th ECTC, pp 916–921Google Scholar
  18. 18.
    Pang JHL, Che FX, Low TH (2004) Vibration fatigue analysis for FCOB solder joints. Proceedings of IEEE, 2004 electronic components and technology conference, 54th ECTC, vol 1, pp 1055–1061Google Scholar
  19. 19.
    Pang JHL, Patrick, Low TH, Xiong BS (2004) Lead-free 95.5Sn-3.8Ag-0.7Cu solder joint reliability analysis for micro-BGA assembly. Proceedings of IEEE, 2004 inter society conference on thermal phenomena, ITherm 2004, vol 2, pp 131–136Google Scholar
  20. 20.
    Pang JHL, Yeo A, Low TH, Che FX (2004) Lead-free 96.5Sn-3.5Ag flip chip solder joint reliability analysis. Proceedings of IEEE, 2004 inter society conference on thermal phenomena, ITherm 2004, vol 2, pp 160–164Google Scholar

Copyright information

© Springer Science+Business Media, LLC 2012

Authors and Affiliations

  1. 1.School of Mechanical and Aerospace EngineeringNanyang Technological UniversitySingaporeSingapore

Personalised recommendations