Abstract
Free-standing metallic thin films are increasingly used as structural components in MEMS. In commercial devices, long-term reliability is essential, which requires determining time-dependent mechanical properties of these films. The uniaxial tensile test is a preferred method due to uncomplicated determination of the stress and strain state. However, at the MEMS-scale this method is not straightforward: specimen handling and loading, force and deformation measurement need careful consideration. Here we discuss the challenges of the application and measurement of nano-Newton forces, nanometer deformations and micro-radians rotation alignment ensuring negligible bending in on-chip tensile test structures during long periods. We then present a novel tensile-testing instrument with in-situ capabilities in SEM and Optical Profilometry. The design solutions to measure these small forces and deformations whilst ensuring a uniaxial stress state will be presented.
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Bergers, L.I.J.C., Hoefnagels, J.P.M., Dekkers, E.C.A., Geers, M.G.D. (2011). A nano-tensile tester for creep studies. In: Proulx, T. (eds) MEMS and Nanotechnology, Volume 4. Conference Proceedings of the Society for Experimental Mechanics Series. Springer, New York, NY. https://doi.org/10.1007/978-1-4614-0210-7_4
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DOI: https://doi.org/10.1007/978-1-4614-0210-7_4
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Publisher Name: Springer, New York, NY
Print ISBN: 978-1-4614-0209-1
Online ISBN: 978-1-4614-0210-7
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