Abstract
Microelectronic devices are multilayered structures with many different interfaces. Their mechanical reliability is of utmost importance when considering the implementation of new materials. The cohesive interface modeling approach has the capability of modeling crack nucleation and growth, provided interfacial parameters such as strength and toughness of the system are available. These parameters are obtained through the extraction of traction-separation relations, through indirect either hybrid numerical/experimental methods or direct experimental methods. The direct method promises to determine the parameters in an unambiguous manner. All methods of extracting traction-separation relations require some local feature of the crack-tip region to be measured.
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© 2011 Springer Science+Business Media, LLC
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Gowrishankar, S., Mei, H., Liechti, K.M., Huang, R. (2011). Direct Determination of Interfacial Traction-Separation Relations in Chip-Package Systems. In: Proulx, T. (eds) MEMS and Nanotechnology, Volume 4. Conference Proceedings of the Society for Experimental Mechanics Series. Springer, New York, NY. https://doi.org/10.1007/978-1-4614-0210-7_28
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DOI: https://doi.org/10.1007/978-1-4614-0210-7_28
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