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Hierarchical Reliability Model for Life Prediction of Actively Cooled LED-Based Luminaire

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Abstract

The interest in light-emitting diodes (LEDs) for illumination applications has been increasing continuously over the last decade due to two key attributes of long lifetime and low energy consumption compared to the conventional incandescent light and compact fluorescent light. Although LEDs are attractive for lighting applications due to the aforementioned advantages, unique technical challenges, such as the extreme sensitivity of luminous output and useful lifetime to LED junction temperature, need to be overcome for their large-scale commercialization.

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References

  1. Residential Recessed Downlights, in Energy Efficiency and Renewable Energy, LED Application

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  2. Series, U.S. Department of Energy, 2008.

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  3. M. Arik and S. Weaver, "Effect of chip and bonding defects on the junction temperatures of highbrightness light-emitting diodes," Optical Engineering 44(11), 111305–8 (2005).

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© 2011 Springer Science+Business Media, LLC

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Song, BM., Han, B., Bar-Cohen, A., Sharma, R., Arik, M. (2011). Hierarchical Reliability Model for Life Prediction of Actively Cooled LED-Based Luminaire. In: Proulx, T. (eds) MEMS and Nanotechnology, Volume 4. Conference Proceedings of the Society for Experimental Mechanics Series. Springer, New York, NY. https://doi.org/10.1007/978-1-4614-0210-7_27

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  • DOI: https://doi.org/10.1007/978-1-4614-0210-7_27

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  • Publisher Name: Springer, New York, NY

  • Print ISBN: 978-1-4614-0209-1

  • Online ISBN: 978-1-4614-0210-7

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