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AC Losses of 19-Strand Subcables for the ANL 3.3 MJ Coil

  • S. H. Kim
  • J. W. Dawson
  • D. G. McGhee
  • S. S. Shen
Part of the Advances in Cryogenic Engineering book series (ACRE, volume 30)

Abstract

Designs of multistrand-cable conductors for poloidal field and energy storage coils require low ac losses and cryostability. Even if the electromagnetic forces of these pulsed coils are generally supported by separate structural components the mechanical rigidity of the cable can significantly influence the performance of the coil. One way to improve the above factors is compacting or solder filling of the subcables. There have been considerable studies related to solder filling and ac losses of several kinds of subcable structures.1,2

Keywords

Copper Wire Hysteresis Loss Poloidal Field Eddy Current Loss Mechanical Rigidity 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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References

  1. 1.
    S. S. Shen and R. E. Schwall, Losses and Transient Field Effect in Superconducting Cables for PF and TF Coils, Proc. of 6th Symposium on Engineering Problems of Fusion Research IEEE Pub. No. 77CH1267–4-NPS: 1293 (1977).Google Scholar
  2. 2.
    H. Tateishi, T. Onishi, K. Komuro, and K. Koyama, The Influence of Solder-filling on the ac Losses of Pulsed Superconducting Cables, Cryogenics 20: 509 (1982).CrossRefGoogle Scholar
  3. 3.
    S. H. Kim, C. I. Krieger, and D. G. McGhee, Further Tests of the Argonne 3.3 MJ Pulsed Superconducting Coil and its Nonmetallic Cryostat, IEEE Trans. on Magnetics MAG-19: 346 (1983).Google Scholar
  4. 4.
    S. S. Shen and R. E. Schwall, Transient Loss Analysis and Measurements on Normal Conductors and Composite Superconductors, in: “Proc. 7th Int. Cryogenic Engineering Conf.,” IPC Science and Technology Press, Surrey (1979), p. 659.Google Scholar
  5. 5.
    B. Turck, Coupling Losses in Various Outer Normal Layers Surrounding the Filament Bundle of a Superconducting Composite, J. Appl. Phys. 50: 5397 (1979).CrossRefGoogle Scholar

Copyright information

© Springer Science+Business Media New York 1984

Authors and Affiliations

  • S. H. Kim
    • 1
  • J. W. Dawson
    • 1
  • D. G. McGhee
    • 1
  • S. S. Shen
    • 2
  1. 1.Argonne National LaboratoryArgonneUSA
  2. 2.Oak Ridge National LaboratoryOak RidgeUSA

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