Low-Temperature Thermal Conductivity and Dislocation Structures in Copper-Aluminum Alloys under High-Cycle, Low-Stress Fatigue

  • T. K. Chu
Part of the Advances in Cryogenic Engineering book series (ACRE, volume 22)


Low-temperature thermal conductivity measurements have been shown in recent years [1,2,3] to yield information on dislocations in mechanically deformed materials. More specifically, the lattice component of the thermal conductivity (phonon conductivity) at low temperatures is sensitive to dislocations and their spatial arrangements, and hence can be a useful tool in the study of mechanical deformation. This low-temperature lattice thermal conductivity method, besides having the advantage of being nondestructive to the samples, would be especially useful in investigating deformations at low temperatures. With the proper design of apparatus, it is possible to carry out the deformation and the thermal conductivity measurements without specimen warming.


Dislocation Density Dislocation Structure Cyclic Deformation Lattice Thermal Conductivity Crystal Matrix 
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Copyright information

© Springer Science+Business Media New York 1977

Authors and Affiliations

  • T. K. Chu
    • 1
  1. 1.University of ConnecticutStorrsUSA

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