Low-Temperature Thermal Conductivity and Dislocation Structures in Copper-Aluminum Alloys under High-Cycle, Low-Stress Fatigue
Low-temperature thermal conductivity measurements have been shown in recent years [1,2,3] to yield information on dislocations in mechanically deformed materials. More specifically, the lattice component of the thermal conductivity (phonon conductivity) at low temperatures is sensitive to dislocations and their spatial arrangements, and hence can be a useful tool in the study of mechanical deformation. This low-temperature lattice thermal conductivity method, besides having the advantage of being nondestructive to the samples, would be especially useful in investigating deformations at low temperatures. With the proper design of apparatus, it is possible to carry out the deformation and the thermal conductivity measurements without specimen warming.
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