Abstract
In pulsed laser annealing of ion implanted semiconductors, the rapid deposition of energy into the near surface region leads to melting of the surface to a depth of several thousand angstroms, followed by liquid phase epitaxial regrowth from the underlying substrate (Ferris et al., 1979; White and Peercy, 1980; Gibbons et al., 1981; Appleton and Celler, 1982). In silicon, the velocity of the liquid-solid interface during solidification is calculated (Wang et al., 1978; Baeri et al., 1978) to be several meters/sec and this is confirmed (Galvin et al., 1982) by recent measurements of time-resolved electrical conductivity of the molten layer. Following solidification, the annealed region is observed to be free of any extended defects (Narayan et al., 1978; White et al., 1979), and Group (III,V) impurities are observed to be highly substitutional in the lattice even when their concentrations greatly exceed equilibrium solubility limits (White et al., 1980).
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White, C.W., Zehner, D.M., Campisano, S.U., Cullis, A.G. (1983). Segregation, Supersaturated Alloys and Semiconductor Surfaces. In: Poate, J.M., Foti, G., Jacobson, D.C. (eds) Surface Modification and Alloying. NATO Conference Series, vol 8. Springer, Boston, MA. https://doi.org/10.1007/978-1-4613-3733-1_4
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