Abstract
Printed wiring manufacturers frequently use dry film photoresist to image plated circuit patterns on electroless-plated copper-clad laminate. In this process, resist must adhere to electroless copper during electroplating. This paper reviews factors affecting resist adhesion to electroless copper, including resist type, post-electroless cleaning, resist exposure, electroless copper thickness, deburring, electroplating bath type, and electroless line maintenance and type. The paper also recommends conditions which should allow excellent resist adhesion to electroless during electroplating.
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References
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© 1983 Plenum Press, New York
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Hamilton, W.L. (1983). Factors Affecting Dry Film Photoresist Adhesion on Electroless Copper Surfaces. In: Mittal, K.L. (eds) Adhesion Aspects of Polymeric Coatings. Springer, Boston, MA. https://doi.org/10.1007/978-1-4613-3658-7_31
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DOI: https://doi.org/10.1007/978-1-4613-3658-7_31
Publisher Name: Springer, Boston, MA
Print ISBN: 978-1-4613-3660-0
Online ISBN: 978-1-4613-3658-7
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