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The Use of Coupling Agents to Improve the Adhesion of Polymer Matrices for Electronic Applications

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Abstract

The data obtained on the effects of varying the interface on electrical properties has proved helpful in understanding interfacial bonding applications. It is possible that adhesion measured by a composite’s mechanical performance involves factors that have not been thought essential for adhesion of polymers on a molecular scale. The improved performance, specifically electrical properties, imparted to a number of composites by the use of coupling agents at the interface suggests that these materials may play an important role in understanding the theory of adhesion.

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References

  1. E. P. Pleuddemann, J. Adhesion 2, 184 (1970).

    Article  Google Scholar 

  2. R. Steinman, U. S. Patent 2,688,006 (8/31/54).

    Google Scholar 

  3. M. T. Goebel and R. K. Iler, U. S. Patent 2,544,667 (3/13/51)

    Google Scholar 

  4. T. A. Te Grotenhuis, U. S. Patent 2,841,566 (7/1/58).

    Google Scholar 

  5. D. J. Vaughan, Insulation/Circuits, pp. 35–37, (August 1976).

    Google Scholar 

  6. E. P. Plueddemann in “Interfaces in Polymer Matrix Composites” E. P. Plueddemann, Editor, Academic Press, N.Y., 1974.

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  7. K. L. Mittal, Pure Appl. Chem. 52, 1295 (1980).

    Article  CAS  Google Scholar 

  8. D. J. Vaughan, “A Finish for Improved Electrical Performance in Printed Circuit Boards,” internal communication (10/80).

    Google Scholar 

  9. R. C. Peek, Jr., “The Effects of Varying the Dicyandiamide Concentration in Epoxy Laminates,” IPC TP-355, IPC 24th Annual Meeting, Washington DC (4/81).

    Google Scholar 

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© 1983 Plenum Press, New York

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Vaughan, D.J., Peek, R.C. (1983). The Use of Coupling Agents to Improve the Adhesion of Polymer Matrices for Electronic Applications. In: Mittal, K.L. (eds) Adhesion Aspects of Polymeric Coatings. Springer, Boston, MA. https://doi.org/10.1007/978-1-4613-3658-7_24

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  • DOI: https://doi.org/10.1007/978-1-4613-3658-7_24

  • Publisher Name: Springer, Boston, MA

  • Print ISBN: 978-1-4613-3660-0

  • Online ISBN: 978-1-4613-3658-7

  • eBook Packages: Springer Book Archive

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