Abstract
The data obtained on the effects of varying the interface on electrical properties has proved helpful in understanding interfacial bonding applications. It is possible that adhesion measured by a composite’s mechanical performance involves factors that have not been thought essential for adhesion of polymers on a molecular scale. The improved performance, specifically electrical properties, imparted to a number of composites by the use of coupling agents at the interface suggests that these materials may play an important role in understanding the theory of adhesion.
This is a preview of subscription content, log in via an institution.
Buying options
Tax calculation will be finalised at checkout
Purchases are for personal use only
Learn about institutional subscriptionsPreview
Unable to display preview. Download preview PDF.
References
E. P. Pleuddemann, J. Adhesion 2, 184 (1970).
R. Steinman, U. S. Patent 2,688,006 (8/31/54).
M. T. Goebel and R. K. Iler, U. S. Patent 2,544,667 (3/13/51)
T. A. Te Grotenhuis, U. S. Patent 2,841,566 (7/1/58).
D. J. Vaughan, Insulation/Circuits, pp. 35–37, (August 1976).
E. P. Plueddemann in “Interfaces in Polymer Matrix Composites” E. P. Plueddemann, Editor, Academic Press, N.Y., 1974.
K. L. Mittal, Pure Appl. Chem. 52, 1295 (1980).
D. J. Vaughan, “A Finish for Improved Electrical Performance in Printed Circuit Boards,” internal communication (10/80).
R. C. Peek, Jr., “The Effects of Varying the Dicyandiamide Concentration in Epoxy Laminates,” IPC TP-355, IPC 24th Annual Meeting, Washington DC (4/81).
Author information
Authors and Affiliations
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 1983 Plenum Press, New York
About this chapter
Cite this chapter
Vaughan, D.J., Peek, R.C. (1983). The Use of Coupling Agents to Improve the Adhesion of Polymer Matrices for Electronic Applications. In: Mittal, K.L. (eds) Adhesion Aspects of Polymeric Coatings. Springer, Boston, MA. https://doi.org/10.1007/978-1-4613-3658-7_24
Download citation
DOI: https://doi.org/10.1007/978-1-4613-3658-7_24
Publisher Name: Springer, Boston, MA
Print ISBN: 978-1-4613-3660-0
Online ISBN: 978-1-4613-3658-7
eBook Packages: Springer Book Archive