The Use of Coupling Agents to Improve the Adhesion of Polymer Matrices for Electronic Applications
The data obtained on the effects of varying the interface on electrical properties has proved helpful in understanding interfacial bonding applications. It is possible that adhesion measured by a composite’s mechanical performance involves factors that have not been thought essential for adhesion of polymers on a molecular scale. The improved performance, specifically electrical properties, imparted to a number of composites by the use of coupling agents at the interface suggests that these materials may play an important role in understanding the theory of adhesion.
KeywordsCoupling Agent Molten Solder Vinyl Benzyl Vinyl Silane Epoxy Laminate
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