Abstract
Composites of PTFE with electronically conducting materials are generally made by heating (above the melting point of the PTFE) mixtures or contacting layers of the two substances. The resulting interactions between the polymer and the conducting materials have been elucidated. In addition to the apparent rheological characteristics and thermal degradation of the polymer, the effect of varying electrochemical potential upon the stability of the bond between the PTFE and the electronically conducting material has been examined.
This is a preview of subscription content, log in via an institution.
Buying options
Tax calculation will be finalised at checkout
Purchases are for personal use only
Learn about institutional subscriptionsPreview
Unable to display preview. Download preview PDF.
References
W. M. Vogel and K, A. Klinedinst, Electrochim, Acta, 22, 1385 (1977),
K. A. Klinedinst, W. M. Vogel, and P. Stonehart, J.Mat. Sci, 11 794 (1976).
K. A. Klinedinst and W. M. Vogel, J. Adhesion, 9, 123 (1978).
Standard Method of Test for Tensile Properties of Adhesive Bonds, ASTM No. D897-72 (approved July 10, 1973).
K. L. Mittal, Pure Appl. Chem, 52, 1295 (1980).
H. Leidheiser, Jr. and W. Wang, J. Coatings Tech, 53, 77 (1981)
Author information
Authors and Affiliations
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 1983 Plenum Press, New York
About this chapter
Cite this chapter
Klinedinst, K.A. (1983). PTFE Film Adhesion to Electronically Conducting Materials. In: Mittal, K.L. (eds) Adhesion Aspects of Polymeric Coatings. Springer, Boston, MA. https://doi.org/10.1007/978-1-4613-3658-7_14
Download citation
DOI: https://doi.org/10.1007/978-1-4613-3658-7_14
Publisher Name: Springer, Boston, MA
Print ISBN: 978-1-4613-3660-0
Online ISBN: 978-1-4613-3658-7
eBook Packages: Springer Book Archive