Abstract
It is usual to assume in thermal stress calculations that material properties are independent of temperature. Significant variations do however occur over the working temperature range of the “engineering ceramics”, particularly in the coefficient of thermal conductivity, k. (Godfrey1 has reported decreases of up to 45 per cent in the thermal conductivity of various samples of silicon nitride between 0 and 400 °C.) The question arises: what are the effects of these variations on the stress distributions in ceramic components?
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References
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© 1980 Plenum Press, New York
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Stanley, P., Chau, F.S. (1980). The Effects of the Temperature-Dependence of Properties on the Thermal Stresses in Cylinders. In: Hasselman, D.P.H., Heller, R.A. (eds) Thermal Stresses in Severe Environments. Springer, Boston, MA. https://doi.org/10.1007/978-1-4613-3156-8_6
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DOI: https://doi.org/10.1007/978-1-4613-3156-8_6
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