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The Effects of the Temperature-Dependence of Properties on the Thermal Stresses in Cylinders

  • P. Stanley
  • F. S. Chau

Abstract

It is usual to assume in thermal stress calculations that material properties are independent of temperature. Significant variations do however occur over the working temperature range of the “engineering ceramics”, particularly in the coefficient of thermal conductivity, k. (Godfrey1 has reported decreases of up to 45 per cent in the thermal conductivity of various samples of silicon nitride between 0 and 400 °C.) The question arises: what are the effects of these variations on the stress distributions in ceramic components?

Keywords

Heat Flux Thermal Stress Heat Flow Failure Probability Stress Index 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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References

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    D.J. Godfrey, “A critical review of engineering ceramics relevant to their use in severe thermal environments”, Conference on Non-Metallic Materials for the Royal Navy, Manadon, Plymouth, (1975) 1Google Scholar
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Copyright information

© Plenum Press, New York 1980

Authors and Affiliations

  • P. Stanley
    • 1
  • F. S. Chau
    • 2
  1. 1.Simon Engineering LaboratoriesUniversity of ManchesterManchesterUK
  2. 2.Unilever ResearchSharnbrook BedfordUK

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