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Thermal Stress in Cylindrical Glass Seals in Microelectronic Packages Under Thermal Shock

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Thermal Stresses in Severe Environments

Abstract

In order to ensure the reliability of microelectronic packages, these packages are subjected to various tests which simulate the environments which the packages may experience in service. The present study concerns a detailed investigation of the Thermal Shock Test (Method 1011.2 in MIL-STD-883B [1]).

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References

  1. MIL-STD-883B, Method 1011, “Test Methods and Procedures for Microelectronics,” August 31, 1977.

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  2. R.W. Thomas, “IC Packages and Hermetically Sealed-in Contaminants.” NBS Special Publication 400–9, pp. 4–19, (Dec. 1974).

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  3. C.M. Johnson and L.K. Conaway, “Reliability Evaluation of Hermetic Dual in Line and Flat Microcircuit Packages,” McDonnell-Douglas Unclassified Report, Contract NAS8-31446, Oct. 1976–Dec. 1977.

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  4. M.P. Borom and R.A. Giddings, “Considerations in Designing Glass/Metal Compression Seals to Withstand Thermal Excursions,” Amer. Ceram. Soc. Bull., 55 [12], (Dec. 1976).

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  5. H. Poritsky, “Analysis of Thermal Stresses in Sealed Cylinders and the Effect of Viscous Flow During Anneal,” Physics 5, pp. 406–411, (1934).

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  6. B.E. Gatewood, “Thermal Stresses in Long Cylindrical Bodies,” Phil. Mag. Ser. 7, 32, pp. 282–301, (1941).

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  7. K. Kokini, R.W. Perkins, C. Libove, “Thermal Stress Analysis of Glass Seals in Microelectronic Packages Under Thermal Shock Conditions.” Final Technical Report, No. RADC-TR-79-201, Rome Air Development Center, New York, (July 1979).

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Author information

Authors and Affiliations

  1. Department of Mechanical & Aerospace Engineering, Syracuse University, Syracuse, New York, 13210, USA

    Klod Kokini, Richard W. Perkins & Charles Libove

Authors
  1. Klod Kokini
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  2. Richard W. Perkins
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  3. Charles Libove
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Editor information

Editors and Affiliations

  1. Virginia Polytechnic Institute and State University, Blacksburg, Virginia, USA

    D. P. H. Hasselman  & R. A. Heller  & 

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© 1980 Plenum Press, New York

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Kokini, K., Perkins, R.W., Libove, C. (1980). Thermal Stress in Cylindrical Glass Seals in Microelectronic Packages Under Thermal Shock. In: Hasselman, D.P.H., Heller, R.A. (eds) Thermal Stresses in Severe Environments. Springer, Boston, MA. https://doi.org/10.1007/978-1-4613-3156-8_27

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  • DOI: https://doi.org/10.1007/978-1-4613-3156-8_27

  • Publisher Name: Springer, Boston, MA

  • Print ISBN: 978-1-4613-3158-2

  • Online ISBN: 978-1-4613-3156-8

  • eBook Packages: Springer Book Archive

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