Abstract
Microscopic and macroscopic aspects of adhesion science are currently under investigations in order to better understand the fundamentals of adhesive behavior from bond formation to bond deterioration/failure. Results of three novel experimental methods are described: a) Measurements using an improved shear specimen design indicate the absence of Mode II failure in a brittle epoxy system. b) Results of ultrasonic Rayleigh wave measurements indicate a possible mechanical properties gradient in the cured resin within the interfacial region of an epoxy-aluminum bond, c) Thermally stimulated dipole relaxation measurements indicate structural gradients within this region.
This is an abridged version of the paper “Some Novel Approaches to the Study of Adhesive Interface Phenomena and Bond Strength” presented at the Structural Adhesives and Bonding Conference, Technology Conferences Associates, P.O. Box 842, El Segundo, Ca., March 13–15, 1979.
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© 1980 Plenum Press, New York
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Jonath, A.D. (1980). New Approach to the Understanding of Adhesive Interface Phenomena and Bond Strength. In: Lee, LH. (eds) Adhesion and Adsorption of Polymers. Polymer Science and Technology, vol 12. Springer, Boston, MA. https://doi.org/10.1007/978-1-4613-3093-6_14
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DOI: https://doi.org/10.1007/978-1-4613-3093-6_14
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