Abstract
In this study, the effect of adhesive bondline thickness on the stress distribution in an adhesively bonded joint is examined. A linear variation in bondline stresses through the adhesive thickness is used to model this effect. In this way, an important influence on bond behavior, heretofore neglected or incompletely modeled, is studied. Also presented is a parametric study of the effect of various joint parameters on bondline stress distribution when thickness effects are included.
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© 1984 Plenum Press, New York
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Kline, R.A. (1984). Stress Analysis of Adhesively Bonded Joints. In: Mittal, K.L. (eds) Adhesive Joints. Springer, Boston, MA. https://doi.org/10.1007/978-1-4613-2749-3_35
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DOI: https://doi.org/10.1007/978-1-4613-2749-3_35
Publisher Name: Springer, Boston, MA
Print ISBN: 978-1-4612-9702-4
Online ISBN: 978-1-4613-2749-3
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