Importance of Interfaces in Microelectronic Device Fabrication

  • J. N. Helbert
  • F. Y. Robb
  • B. R. Svechovsky
  • N. C. Saha


Microelectronic device fabrication currently relies totally upon photoresist processing for pattern delineation in integrated circuit fabrication. Adhesion of polymeric photoresist patterns, especially those of submicron dimensions, to the various substrates encountered is therefore of paramount importance. Poor photoresist adhesion has been cured by a variety of processes involving (1) double silane promoter applications, (2) plasma treatments, and (3) vapor phase HMDS treatment. Overall, the vapor phase HMDS treatment appears to be the most efficient, and excellent photoresist adhesion test results have been obtained.


Surfactant Silane Argon Chlorine Shrinkage 


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Copyright information

© Plenum Press, New York 1987

Authors and Affiliations

  • J. N. Helbert
    • 1
  • F. Y. Robb
    • 1
  • B. R. Svechovsky
    • 1
  • N. C. Saha
    • 1
  1. 1.Process Technology Lab and Semiconductor Analytical Lab/SRDLMotorola SPSPhoenixUSA

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