Abstract
Adhesion between metals and polymers has been a subject of practical concern in the microelectronic packaging technology. Formation of chemical bonds promises the type of adhesion favored by the new processing techniques being developed in the industry. In an earlier paper, a thermodynamic model was proposed where an effective partial molar energy was defined for the pendent oxygen in the cured polyimide (PI) and its limiting values determined experimentally by in-situ XPS monitoring of interfacial reaction during metallization. Used to predict whether a metal will form chemical bonds with the oxygen in PI, the model was found to be valid for several metals. In this paper a quasichemical approach is used to examine the validity of the assumptions on which the model is based. It is shown that until a detailed quantum mechanical treatment is made, some of these assumptions should be regarded as a mixture of truth and expediency.
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References
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© 1987 Plenum Press, New York
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Chou, N.J., Tang, C.H. (1987). A Thermodynamic Model for Predicting Formation of Chemical Bonds between Metals and Cured Polyimides During Metallization. In: Mittal, K.L. (eds) Surface and Colloid Science in Computer Technology. Springer, Boston, MA. https://doi.org/10.1007/978-1-4613-1905-4_17
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DOI: https://doi.org/10.1007/978-1-4613-1905-4_17
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