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Nuclear Scattering Profiles of Polyimide-Metal Interfaces

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Surface and Colloid Science in Computer Technology

Abstract

Nuclear scattering profiles of polyimide-metal interfaces were obtained using the Elastic Recoil Detection and Rutherford Backscattering techniques. Metallized polyimide targets were prepared by evaporation of Al, Cu or Au onto dry and hydrolyzed polyimide film. The nuclear scattering profiles show polymer-metal mixing at the interface. The structure, width and composition of the interphase thus formed depends on the type of metal used. The relation between the extent of mixing and the adhesion of the metallization, as determined by a standard tape test, is discussed.

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Author information

Authors and Affiliations

  1. Groupe des Couches Minces Département de génie physique, École Polytechnique, C.P. 6079, Succursale “A”, Montréal, Québec, Canada, H3C 3A7

    C. Chauvin, E. Sacher & A. Yelon

  2. Groups des Couches Minces Laboratoire de Physique Nucléaire, Université de Montréal, C.P. 6128, Succursale “A”, Montréal, Québec, Canada, H3C 3J7

    R. Groleau & S. Gujrathi

Authors
  1. C. Chauvin
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  2. E. Sacher
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  3. A. Yelon
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  4. R. Groleau
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  5. S. Gujrathi
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Editor information

Editors and Affiliations

  1. IBM Corporate Technical Institutes, 500 Columbus Ave., Thornwood, NY, 10594, USA

    Kashmiri Lal Mittal M.Sc. (First Class First) Ph.D. (senior Institute staff member, Fellow of the American Institute of Chemists and Indian Chemical Society) (senior Institute staff member, Fellow of the American Institute of Chemists and Indian Chemical Society)

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© 1987 Plenum Press, New York

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Chauvin, C., Sacher, E., Yelon, A., Groleau, R., Gujrathi, S. (1987). Nuclear Scattering Profiles of Polyimide-Metal Interfaces. In: Mittal, K.L. (eds) Surface and Colloid Science in Computer Technology. Springer, Boston, MA. https://doi.org/10.1007/978-1-4613-1905-4_16

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  • DOI: https://doi.org/10.1007/978-1-4613-1905-4_16

  • Publisher Name: Springer, Boston, MA

  • Print ISBN: 978-1-4612-9060-5

  • Online ISBN: 978-1-4613-1905-4

  • eBook Packages: Springer Book Archive

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