Abstract
The new contamination model in conjunction with CODEF can be successfully used to solve a number of IC manufacturing problems related to fault modeling and failure analysis. In order to make CODEF more universal and efficient, though, work must be done in a number of areas. These are outlined below.
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References
S. P. Murarka and M, C. Peckerar, Electronic Materials Science and Technology, Academic Press, San Diego, CA, 1989.
S. M. Sze, VLSI Technology, McGraw-Hill Book Company, New York, NY, 1984.
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© 1996 Kluwer Academic Publishers
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Khare, J.B., Maly, W. (1996). Possible Extensions. In: From Contamination to Defects, Faults and Yield Loss. Frontiers in Electronic Testing, vol 5. Springer, Boston, MA. https://doi.org/10.1007/978-1-4613-1377-9_6
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DOI: https://doi.org/10.1007/978-1-4613-1377-9_6
Publisher Name: Springer, Boston, MA
Print ISBN: 978-1-4612-8595-3
Online ISBN: 978-1-4613-1377-9
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