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Packaging Considerations

  • G. Theodore Dangelmayer

Abstract

Although packaging is intended to provide protection for its contents, it can be the cause of ESD failures unless special materials and/or procedures are used. The successful implementation of ESD-protective packaging procedures depends on having a basic understanding of how sensitive devices may be damaged in a package or during the packaging procedure and how the protective procedures work.

Keywords

Conductive Material Surface Resistivity Dielectric Breakdown Sensitive Device Static Dissipative 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© AT&T Bell Laboratories 1990

Authors and Affiliations

  • G. Theodore Dangelmayer
    • 1
  1. 1.AT&T Network SystemsUSA

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