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Characterization of Film Adhesion by Acoustic Microscopy

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Review of Progress in Quantitative Nondestructive Evaluation

Abstract

Accurate and reliable information on adhesive bond strength between dissimilar solids is an important factor in joint technology. In spite of considerable efforts to obtain a quantitative measure of film adhesion, this parameter remains elusive, particularly so in cases where non-destructive means of determination are desirable if not mandatory.

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References

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Author information

Authors and Affiliations

  1. Mechanical, Aerospace & Nuclear Engineering Department, University of California, Los Angeles, CA, 90024, USA

    A. K. Mal

  2. 6317 Drexel Avenue, Los Angeles, CA, 90048, USA

    R. D. Weglein (Consultant)

Authors
  1. A. K. Mal
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  2. R. D. Weglein
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Editor information

Editors and Affiliations

  1. Ames Laboratory (USDOE), Iowa State University, Ames, Iowa, USA

    Donald O. Thompson

  2. Materials Laboratory, Air Force Wright Aeronautical Laboratories, Wright-Patterson Air Force Base, Dayton, Ohio, USA

    Dale E. Chimenti

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© 1988 Plenum Press, New York

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Mal, A.K., Weglein, R.D. (1988). Characterization of Film Adhesion by Acoustic Microscopy. In: Thompson, D.O., Chimenti, D.E. (eds) Review of Progress in Quantitative Nondestructive Evaluation. Springer, Boston, MA. https://doi.org/10.1007/978-1-4613-0979-6_3

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  • DOI: https://doi.org/10.1007/978-1-4613-0979-6_3

  • Publisher Name: Springer, Boston, MA

  • Print ISBN: 978-1-4612-8275-4

  • Online ISBN: 978-1-4613-0979-6

  • eBook Packages: Springer Book Archive

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