Abstract
In additive processes, a solid or precursor is deposited through a resist mask onto a substrate. The solid is deposited from a liquid, gas, or solid state. In some cases, the solid is added to the resist and the resist is removed to deposit the solid. Metal films are most frequently deposited by lift-off or electroplating techniques. In Fig. 12-1-1, a panorama of additive processes using resists is shown. Some of the processes such as electroplating, fill and fire resists, and lift-off originated from printed circuit (mil-size) processes. By themselves, the resists find applications as light waveguides in optical information transmission and storage. For semiconductor fabrication, ionbeam implantation and the lift-off of metal interconnections have been the major uses of additive processing.
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Moreau, W.M. (1988). Additive Processes. In: Semiconductor Lithography. Microdevices. Springer, Boston, MA. https://doi.org/10.1007/978-1-4613-0885-0_12
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