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Postbake

  • Chapter
Semiconductor Lithography

Part of the book series: Microdevices ((MDPF))

Abstract

Postbake or hardbake, initially used to harden printing plate resists, is the process of applying heat to enhance the performance of a developed resist image. Later the procedure was applied to deswell developed images in negative rubber azide resists. More recently, the process has been applied to improve the performance of DQN resists.

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Authors and Affiliations

  1. General Technology Division, International Business Machines Corporation, Hopewell Junction, New York, USA

    Wayne M. Moreau

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  1. Wayne M. Moreau
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© 1988 Plenum Press, New York

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Moreau, W.M. (1988). Postbake. In: Semiconductor Lithography. Microdevices. Springer, Boston, MA. https://doi.org/10.1007/978-1-4613-0885-0_11

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  • DOI: https://doi.org/10.1007/978-1-4613-0885-0_11

  • Publisher Name: Springer, Boston, MA

  • Print ISBN: 978-1-4612-8228-0

  • Online ISBN: 978-1-4613-0885-0

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