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Introduction

  • Wayne M. Moreau
Part of the Microdevices book series (MDPF)

Abstract

The production of a semiconductor device begins with a silicon wafer which after several thousand steps (Fig. 1-1-1) becomes a fully packaged and integrated electronic component. One-third of the cost of manufacturing involves lithography and hot processing. The other costs are associated with the packaging of the computer chip and the extensive electrical testing of all the components. For semiconductor manufacturing, the device fabrication steps involve (Fig. 1-1-2) the liquid processing operations of photolithography and the hot processing of wafers. The hot processes are divided into three major operations:
  1. 1.

    Thin film deposition: includes chemical vapor deposition of insulating films, plasma deposited and sputtered deposited films, and evaporated metal films

     
  2. 2.

    Oxidations: growth of diffusion barriers by thermal oxidation of silicon

     
  3. 3.

    Diffusion/implantation: tubular batch diffusion of dopants of P, B, and As and implantation with ion beams of dopants masked by resist or oxide windows

     

Keywords

Silicon Wafer Negative Photoresist Solid State Technology Electron Beam Technology Diallyl Phthalate 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Plenum Press, New York 1988

Authors and Affiliations

  • Wayne M. Moreau
    • 1
  1. 1.General Technology DivisionInternational Business Machines CorporationNew YorkUSA

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