Abstract
The verification of the adhesive bonds is one of the major problems in many fields. Different methods were suggested to check the quality of the bonds between a layer and a layer or a substrate. Most of these techniques are based on a spectral analysis of the acoustical signal reflected at normal incidence [1–5]. In this paper we focalize our attention on the analysis of the phase velocity dispersion curves characterizing the different samples and we suggest the use of these curves for checking the quality of the bonds.
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References
G. A. Alers, P. Y. Flynn and M. J. Buckley, Mat. Eval. 77–84 (April 77).
J. C. Couchman, F. H. Chang, B. G. W. Yee and J. R. Bell, IEEE Trans. on Sonics and Ultra. SU-25, 5–293–300 (1978).
C. C. H. Guyott, P. Cauley and R. D. Adams, Journal of Adhesion, Vol. 20, 129–159 (1986).
G. Biggiero, G. Canella and A. Moschini, NDT Inter. April 83 (pp. 67–73).
A. Pilarski, Mat. Eval., 43, pp. 765–770 (1985).
A. H. Nayfeh and D. E. Chimenti, J. Acoust. Soc. Am., 75, 1360–1368 (1984).
M. Hattunen and M. Luukkala, Appl. Phys. 2, 257–263 (1973).
M. Luukkala and M. Hattunen, Appl. Phys. Letters 19, 56–57 (1971).
G. W. Farnell and E. L. Adler, Physical Acoustics Vol. IX, Academic Press, New York (1972), Chap. 2.
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© 1989 Springer Science+Business Media New York
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Leomy, F., de Billy, M., Quentin, G. (1989). Dispersive Ultrasonic Waves in Adhesive Bonds. In: Thompson, D.O., Chimenti, D.E. (eds) Review of Progress in Quantitative Nondestructive Evaluation. Springer, Boston, MA. https://doi.org/10.1007/978-1-4613-0817-1_176
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DOI: https://doi.org/10.1007/978-1-4613-0817-1_176
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