Abstract
In the past several years the electronics industry has been making a concerted effort to improve the quality and reliability of the integrated circuits (ICs) which make up computers. In order to assure this high reliability, a reliable and inexpensive method for the nondestructive evaluation (NDE) of IC packages is needed. Radiographic analysis of plastic packages, primarily used for the location of bond wires and the evaluation of die attach material distribution, does not provide any information about the silicon chip or the internal bond quality and has thus proven inadequate at detecting a number of plastic package defects.
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© 1988 Plenum Press, New York
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Tatistcheff, E.M. (1988). Evaluation of Plastic Packages for Integrated Circuits Using Scanning Laser Acoustic Microscopy (SLAM). In: Kessler, L.W. (eds) Acoustical Imaging. Acoustical Imaging, vol 16. Springer, Boston, MA. https://doi.org/10.1007/978-1-4613-0725-9_12
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DOI: https://doi.org/10.1007/978-1-4613-0725-9_12
Publisher Name: Springer, Boston, MA
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