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Convergent Beam Electron Diffraction Studies of Defects, Strains and Composition Profiles in Semiconductors

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Evaluation of Advanced Semiconductor Materials by Electron Microscopy

Part of the book series: NATO ASI Series ((NSSB,volume 203))

Summary

This paper shows how convergent beam electron diffraction has been used at Bristol to study strains, defects and composition profiles in plan-view semiconductor multilayers. It is shown that epitaxial strains in bicrystals and multilayers can be measured down to ~ 0.1% and that varying strain fields near dislocations and interfaces can be investigated with high sensitivity. It is also shown that convergent beam diffraction gives a powerful new method of examining superlattice reflections from both periodic and irregular multilayer structures and studies of single quantum well samples of AlGaAs/GaAs and InP/InGaAs, which give well thicknesses to near monolayer precision, are also described.

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References

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© 1989 Plenum Press, New York

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Cherns, D. (1989). Convergent Beam Electron Diffraction Studies of Defects, Strains and Composition Profiles in Semiconductors. In: Cherns, D. (eds) Evaluation of Advanced Semiconductor Materials by Electron Microscopy. NATO ASI Series, vol 203. Springer, Boston, MA. https://doi.org/10.1007/978-1-4613-0527-9_5

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  • DOI: https://doi.org/10.1007/978-1-4613-0527-9_5

  • Publisher Name: Springer, Boston, MA

  • Print ISBN: 978-1-4612-7850-4

  • Online ISBN: 978-1-4613-0527-9

  • eBook Packages: Springer Book Archive

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